Brand Name : Mengde
Model Number : SLP
Certification : ISO9001
Place of Origin : China
MOQ : 25kg
Price : Negotiation
Payment Terms : T/T
Supply Ability : 10 MT per month
Delivery Time : 20 working days after received your payment
Packaging Details : Packed in a plastic drum
Product Code : SLP
Concentration : ≥50%
Applications : Throwing power, Leveling agent in LCD area for acid copper plating baths
Appearance : Clear transparent liquid
SLP, Electroplating intermedaite for acid copper, Throwing power, leveling agent in LCD area
|Content in Baths||0.02-0.05ml/L|
|Appearance||Clear transparent liquid|
SLP has very good throwing power and covering powder, especially is excellent in LCD leveling. It’s normally used as an intermediate of acid copper additive for printed circuit board plating. SLP is very suitable for printed circuit board through-hole filling. No negative effects occurs if SLP is too much in baths, whereas the more SLP is added to baths, the better effects will be in LCD.
SLP can be combined with other nickel plating intermediates such as SPS, SH110, PN, MT-480 and PEG 6000.
SLP can be applied on the following process:
Packing and Storage
Packed in a plastic drum, stored in cool and dry place.
SLP Electroplating Solution , Electroplating Additives For Printed Circuit Board Plating Images